Partner: Piotr Bazarnik

Warsaw University of Technology (PL)

Recent publications
1.Jarząbek D.M., Milczarek M., Nosewicz S., Bazarnik P., Schift H., Size effects of hardness and strain rate sensitivity in amorphous silicon measured by nanoindentation, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, ISSN: 1073-5623, DOI: 10.1007/s11661-020-05648-w, Vol.51, No.4, pp.1625-1633, 2020
Abstract:

In this work, dynamic mechanical properties of amorphous silicon and scale effects were investigated by the means of nanoindentation. An amorphous silicon sample was prepared by plasma-enhanced chemical vapor deposition (PECVD). Next, two sets of the samples were investigated: as-deposited and annealed in 500 °C for 1 hour. A three-sided pyramidal diamond Berkovich's indenter was used for the nanoindentation tests. In order to determine the strain rate sensitivity (SRS), indentations with different loading rates were performed: 0.1, 1, 10, 100 mN/min. Size effects were studied by application of maximum indentation loads in the range from 1 up to 5 mN (penetrating up to approximately one-third of the amorphous layer). The value of hardness was determined by the Oliver-Pharr method. An increase of hardness with decrease of the indentation depth was observed for both samples. Furthermore, the significant dependence of hardness on the strain rate has been reported. Finally, for the annealed samples at low strain rates a characteristic "elbow" during unloading was observed on the force-indentation depth curves. It could be attributed to the transformation of (β-Sn)-Si to the PI (pressure-induced) a-Si end phase.

Affiliations:
Jarząbek D.M.-IPPT PAN
Milczarek M.-IPPT PAN
Nosewicz S.-IPPT PAN
Bazarnik P.-Warsaw University of Technology (PL)
Schift H.-Paul Scherrer Institut (CH)
2.Mościcki T., Psiuk R., Słomińska H., Levintant-Zayonts N., Garbiec D., Pisarek M., Bazarnik P., Nosewicz S., Chrzanowska-Giżyńska J., Influence of overstoichiometric boron and titanium addition on the properties of RF magnetron sputtered tungsten borides, SURFACE AND COATINGS TECHNOLOGY, ISSN: 0257-8972, DOI: 10.1016/j.surfcoat.2020.125689, Vol.390, pp.125689-1-12, 2020
Abstract:

In this work, (W,Ti)B2 films with different stoichiometric ratio Ti/W deposited on silicon and 304 stainless steel by radio frequency magnetron sputtering are presented. The coatings were deposited from plasma spark sintered targets obtained from the mixture of pure boron, tungsten and titanium powders. It is shown that during plasma spark sintering process using overstoichiometric boron and a low content of titanium change the WB2 to WB4 phase with almost no secondary phases. Subsequently, the impact of titanium content on the films properties is investigated systematically, including the chemical and phase composition, crystalline structure, surface and cross-section morphology. Simultaneously, nano-indentation test and ball-on-disk tribometery are performed to analyse the hardness and tribological properties of the films. It is shown that deposited films with titanium content of 3.6 and 5.5 at.% are formed in the zone T of the Thornton's Structural Zone Model. In opposite to α-WB2 magnetron sputtered coatings they are more flexible and hard nanocomposite coatings. The results show that the addition of titanium is apparently changing the film structure from nanocrystalline columnar to amorphous, very dense and compact structure with the addition of TiB2 phase. That films are simultaneously hard (H > 37.5 GPa), have high hardness to effective Young's modulus ratio values (H/E* > 0.1) and elastic recovery (We > 60%) appropriate for tough and resistant to cracking materials. The presented (W,Ti)B2 films exhibit also tribological and corrosion properties better than unalloyed coatings.

Keywords:

superhard films, ternary tungsten borides, RF magnetron sputtering, wear resistance, corrosion

Affiliations:
Mościcki T.-IPPT PAN
Psiuk R.-IPPT PAN
Słomińska H.-IPPT PAN
Levintant-Zayonts N.-IPPT PAN
Garbiec D.-Metal Forming Institute, Poznań (PL)
Pisarek M.-other affiliation
Bazarnik P.-Warsaw University of Technology (PL)
Nosewicz S.-IPPT PAN
Chrzanowska-Giżyńska J.-IPPT PAN
3.Nosewicz S., Romelczyk-Baishya B., Lumelskyj D., Chmielewski M., Bazarnik P., Jarząbek D.M., Pietrzak K., Kaszyca K., Pakieła Z., Experimental and numerical studies of micro- and macromechanical properties of modified copper–silicon carbide composites, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, ISSN: 0020-7683, DOI: 10.1016/j.ijsolstr.2018.10.025, Vol.160, pp.187-200, 2019
Abstract:

The presented research investigation comprises the study of the mechanical properties of modified copper–silicon carbide composites at the micro- and macroscopic scale. The improvement of a copper–silicon carbide composite refers to the addition of a protective layer at the ceramic reinforcement in order to prevent the dissolution of silicon in the copper matrix. The macromechanical behaviour has been evaluated by the performance in a small punch test. The investigation has been carried out with samples with varying volume content of ceramic reinforcement and different protective layers of the silicon carbide particles. Moreover, the influence of temperature during the strength test has been studied. Next, the results have been referred to the interfacial bonding strength of Cu and SiC particles. SEM characterization of samples has been performed to link the composites' microstructure with the mechanical behaviour. Finally, the experimental results of the small punch test have been predicted via a numerical approach. Finite element analysis has been employed to reproduce the response of the composite specimen during the test. Satisfactory agreement with the experimental curve has been obtained.

Keywords:

metal matrix composites, silicon carbide, metallic layers deposition, small punch, interface strength, finite element method

Affiliations:
Nosewicz S.-IPPT PAN
Romelczyk-Baishya B.-Warsaw University of Technology (PL)
Lumelskyj D.-IPPT PAN
Chmielewski M.-Institute of Electronic Materials Technology (PL)
Bazarnik P.-Warsaw University of Technology (PL)
Jarząbek D.M.-IPPT PAN
Pietrzak K.-other affiliation
Kaszyca K.-other affiliation
Pakieła Z.-Warsaw University of Technology (PL)
4.Bazarnik P., Nosewicz S., Romelczyk-Baishya B., Chmielewski M., Strojny-Nędza A., Maj J., Huang Y., Lewandowska M., Langdon T.G., Effect of spark plasma sintering and high-pressure torsion on the microstructural and mechanical properties of a Cu–SiC composite, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, ISSN: 0921-5093, DOI: 10.1016/j.msea.2019.138350, Vol.766, pp.138350-1-11, 2019
Abstract:

This investigation examines the problem of homogenization in metal matrix composites (MMCs) and the methods of increasing their strength using severe plastic deformation (SPD). In this research MMCs of pure copper and silicon carbide were synthesized by spark plasma sintering (SPS) and then further processed via high-pressure torsion (HPT). The microstructures in the sintered and in the deformed materials were investigated using Scanning Electron Microscopy (SEM) and Scanning Transmission Electron Microscopy (STEM). The mechanical properties were evaluated in microhardness tests and in tensile testing. The thermal conductivity of the composites was measured with the use of a laser pulse technique. Microstructural analysis revealed that HPT processing leads to an improved densification of the SPS-produced composites with significant grain refinement in the copper matrix and with fragmentation of the SiC particles and their homogeneous distribution in the copper matrix. The HPT processing of Cu and the Cu–SiC samples enhanced their mechanical properties at the expense of limiting their plasticity. Processing by HPT also had a major influence on the thermal conductivity of materials. It is demonstrated that the deformed samples exhibit higher thermal conductivity than the initial coarse-grained samples.

Keywords:

copper, silicon carbide, high-pressure torsion, spark plasma sintering, thermal conductivity

Affiliations:
Bazarnik P.-Warsaw University of Technology (PL)
Nosewicz S.-IPPT PAN
Romelczyk-Baishya B.-Warsaw University of Technology (PL)
Chmielewski M.-Institute of Electronic Materials Technology (PL)
Strojny-Nędza A.-Institute of Electronic Materials Technology (PL)
Maj J.-IPPT PAN
Huang Y.-Bournemouth University (GB)
Lewandowska M.-other affiliation
Langdon T.G.-University of Southampton (GB)
5.Chmielewski M., Nosewicz S., Wyszkowska E., Kurpaska Ł., Strojny-Nędza A., Piątkowska A., Bazarnik P., Pietrzak K., Analysis of the micromechanical properties of copper-silicon carbide composites using nanoindentation measurements, CERAMICS INTERNATIONAL, ISSN: 0272-8842, DOI: 10.1016/j.ceramint.2019.01.257, Vol.45, No.7A, pp.9164-9173, 2019
Abstract:

The study presents a detailed analysis of the impact of the coating type of silicon carbide particles and its share by volume on the microstructure and micromechanical properties of Cu-SiC composites. In order to protect the carbide from decomposition during the manufacturing of the composites, the surface of SiC was modified via a plasma vapour deposition technique with a layer of metals (W, Cr, Ti and Ni). Composites with a variable share of the ceramic phase (10–50 %vol.) were obtained at a temperature of 950 °C using spark plasma sintering. An analysis of the structures of the composites, especially in the metal-ceramic boundary region, was conducted with the use of scanning and transmission electron microscopy. The mechanical properties of the composites in the Cu-interface-SiC system were studied via a nanoindentation technique. The comparison of the results of hardness and Young's modulus studies were completed in relation to the actual structures of the materials, which in turn made it possible to determine the impact of the interfacial structure on the global properties of the composite materials.

Keywords:

copper-silicon carbide composites, nanoindentation, SPS, interface study

Affiliations:
Chmielewski M.-Institute of Electronic Materials Technology (PL)
Nosewicz S.-IPPT PAN
Wyszkowska E.-National Centre for Nuclear Research (PL)
Kurpaska Ł.-National Centre for Nuclear Research (PL)
Strojny-Nędza A.-Institute of Electronic Materials Technology (PL)
Piątkowska A.-Institute of Electronic Materials Technology (PL)
Bazarnik P.-Warsaw University of Technology (PL)
Pietrzak K.-other affiliation
6.Chmielewski M., Pietrzak K., Teodorczyk M., Nosewicz S., Jarząbek D.M., Zybała R., Bazarnik P., Lewandowska M., Strojny-Nędza A., Effect of metallic coating on the properties of copper-silicon carbide composites, APPLIED SURFACE SCIENCE, ISSN: 0169-4332, DOI: 10.1016/j.apsusc.2016.12.130, Vol.421, pp.159-169, 2017
Abstract:

In the presented paper a coating of SiC particles with a metallic layer were used to prepare copper matrix composite materials. The role of the layer was to protect the silicon carbide from decomposition and dissolution of silicon in the copper matrix during the sintering process. The SiC particles were covered by chromium, tungsten and titanium using Plasma Vapour Deposition method. After powder mixing of components, the final densification process via Spark Plasma Sintering (SPS) method at temperature 950C was provided. The almost fully dense materials were obtained (> 97.5%). The microstructure of obtained composites was studied using scanning electron microscopy as well as transmission electron microscopy. The microstructural analysis of composites confirmed that regardless of the type of deposited material, there is no evidence for decomposition process of silicon carbide in copper. In order to measure the strength of the interface between ceramic particles and the metal matrix, the micro tensile tests have been performed. Furthermore, thermal diffusivity was measured with the use of the laser pulse technique. In the context of performed studies, the tungsten coating seems to be the most promising solution for heat sink application. Compared to pure composites without metallic layer, Cu-SiC with W coating indicate the higher tensile strength and thermal diffusitivy, irrespective of an amount of SiC reinforcement. The improvement of the composite properties is related to advantageous condition of Cu-SiC interface characterized by well homogenity and low porosity, as well as individual properties of the tungsten coating material.

Keywords:

metal matrix composites, silicon carbide, metallic layers deposition, thermal conductovity, interface strength

Affiliations:
Chmielewski M.-Institute of Electronic Materials Technology (PL)
Pietrzak K.-other affiliation
Teodorczyk M.-Institute of Electronic Materials Technology (PL)
Nosewicz S.-IPPT PAN
Jarząbek D.M.-IPPT PAN
Zybała R.-Warsaw University of Technology (PL)
Bazarnik P.-Warsaw University of Technology (PL)
Lewandowska M.-other affiliation
Strojny-Nędza A.-Institute of Electronic Materials Technology (PL)
7.Chmielewski M., Pietrzak K., Strojny-Nędza A., Kaszyca K., Zybala R., Bazarnik P., Lewandowska M., Nosewicz S., Microstructure and thermal properties of Cu-SiC composite materials depending on the sintering technique, SCIENCE OF SINTERING, ISSN: 0350-820X, DOI: 10.2298/SOS1701011C, Vol.49, No.1, pp.11-22, 2017
Abstract:

The presented paper investigates the relationship between the microstructure and thermal properties of copper–silicon carbide composites obtained through hot pressing (HP) and spark plasma sintering (SPS) techniques. The microstructural analysis showed a better densification in the case of composites sintered in the SPS process. TEM investigations revealed the presence of silicon in the area of metallic matrix in the region close to metal ceramic boundary. It is the product of silicon dissolving process in copper occurring at an elevated temperature. The Cu-SiC interface is significantly defected in composites obtained through the hot pressing method, which has a major influence on the thermal conductivity of materials.

Keywords:

metal matrix composites, silicon carbide, interface, spark plasma sintering, thermal conductivity

Affiliations:
Chmielewski M.-Institute of Electronic Materials Technology (PL)
Pietrzak K.-other affiliation
Strojny-Nędza A.-Institute of Electronic Materials Technology (PL)
Kaszyca K.-other affiliation
Zybala R.-Warsaw University of Technology (PL)
Bazarnik P.-Warsaw University of Technology (PL)
Lewandowska M.-other affiliation
Nosewicz S.-IPPT PAN
8.Chmielewski M., Nosewicz S., Jakubowska D., Lewandowska M., Mizera J., Rojek J., Bazarnik P., The influence of sintering time on the microstructural properties of chromium-rhenium matrix composites, International Journal of Refractory Metals and Hard Materials, ISSN: 0263-4368, DOI: 10.1016/j.ijrmhm.2016.05.017, Vol.59, pp.78-86, 2016
Abstract:

This paper comprises the results of studies of the changes in the structure of Cr-Re-Al2O3 metal matrix depending on heat treatment time in sintering temperature. The density of material with the following composition: 95%(75%Cr-25%Al2O3)+5%Re was increased using the technique of sintering under pressure (30MPa) at the temperature of 1450°C. As a result, materials characterized by a high relative density (< 97% of theoretical density) were obtained. Next, they were subjected to structural tests including scanning and transmission electron microscopy as well as X-ray diffraction. Changes in the phase composition, grains size and parameters of crystallographic structure depending on heat treatment time were analysed. It was found that during sintering rhenium is dissolved in the chromium matrix and Cr-Re solid solution is formed. When sintering time is extended to 120 min, the matrix of the composite becomes completely homogenous, which results in an increased strength of the composite.

Keywords:

Metal matrix composites, Rhenium, Hot pressing, Microstructure analysis, XRD

Affiliations:
Chmielewski M.-Institute of Electronic Materials Technology (PL)
Nosewicz S.-IPPT PAN
Jakubowska D.-other affiliation
Lewandowska M.-other affiliation
Mizera J.-Warsaw University of Technology (PL)
Rojek J.-IPPT PAN
Bazarnik P.-Warsaw University of Technology (PL)