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Polish Academy of Sciences

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Anna Piątkowska

Institute of Electronic Materials Technology (PL)


Recent publications
1.  Strojny-Nędza A., Egizabal P., Pietrzak K., Zieliński R., Kaszyca K., Piątkowska A., Chmielewski M., Corrosion and thermal shock resistance of metal (Cu, Al) matrix composites reinforced by SiC particles, BULLETIN OF THE POLISH ACADEMY OF SCIENCES: TECHNICAL SCIENCES, ISSN: 0239-7528, DOI: 10.24425/bpasts.2020.134644, Vol.68, No.5, pp.1227-1236, 2020

Abstract:
This paper presents the results of studies concerning the production and characterization of Al-SiC/W and Cu-SiC/W composite materials with a 30% volume fraction of reinforcing phase particles as well as the influence of corrosion and thermal shocks on the properties of selected metal matrix composites. Spark plasma sintering method (SPS) was applied for the purpose of producing these materials. In order to avoid the decomposition of SiC surface, SiC powder was coated with a thin tungsten layer using plasma vapour deposition (PVD) method. The obtained results were analysed by the effect of the corrosion and thermal shocks on materials density, hardness, bending strength, tribological and thermal properties. Qualitative X-ray analysis and observation of microstructure of sample surfaces after corrosion tests and thermal shocks were also conducted. The use of PVD technique allows us to obtain an evenly distributed layer of titanium with a constant thickness of 1.5 μm. It was found that adverse environmental conditions and increased temperature result in a change in the material behaviour in wear tests.

Keywords:
metal-matrix composites, silicon carbide, wear resistance, corrosion, thermal shocks

Affiliations:
Strojny-Nędza A. - Institute of Electronic Materials Technology (PL)
Egizabal P. - Fundacion Tecnalia Research and Innovation (ES)
Pietrzak K. - other affiliation
Zieliński R. - Łukasiewicz Research Network‒Institute of Electronic Materials Technology (PL)
Kaszyca K. - other affiliation
Piątkowska A. - Institute of Electronic Materials Technology (PL)
Chmielewski M. - Institute of Electronic Materials Technology (PL)
2.  Chmielewski M., Nosewicz S., Wyszkowska E., Kurpaska Ł., Strojny-Nędza A., Piątkowska A., Bazarnik P., Pietrzak K., Analysis of the micromechanical properties of copper-silicon carbide composites using nanoindentation measurements, CERAMICS INTERNATIONAL, ISSN: 0272-8842, DOI: 10.1016/j.ceramint.2019.01.257, Vol.45, No.7A, pp.9164-9173, 2019

Abstract:
The study presents a detailed analysis of the impact of the coating type of silicon carbide particles and its share by volume on the microstructure and micromechanical properties of Cu-SiC composites. In order to protect the carbide from decomposition during the manufacturing of the composites, the surface of SiC was modified via a plasma vapour deposition technique with a layer of metals (W, Cr, Ti and Ni). Composites with a variable share of the ceramic phase (10–50 %vol.) were obtained at a temperature of 950 °C using spark plasma sintering. An analysis of the structures of the composites, especially in the metal-ceramic boundary region, was conducted with the use of scanning and transmission electron microscopy. The mechanical properties of the composites in the Cu-interface-SiC system were studied via a nanoindentation technique. The comparison of the results of hardness and Young's modulus studies were completed in relation to the actual structures of the materials, which in turn made it possible to determine the impact of the interfacial structure on the global properties of the composite materials.

Keywords:
copper-silicon carbide composites, nanoindentation, SPS, interface study

Affiliations:
Chmielewski M. - Institute of Electronic Materials Technology (PL)
Nosewicz S. - IPPT PAN
Wyszkowska E. - National Centre for Nuclear Research (PL)
Kurpaska Ł. - National Centre for Nuclear Research (PL)
Strojny-Nędza A. - Institute of Electronic Materials Technology (PL)
Piątkowska A. - Institute of Electronic Materials Technology (PL)
Bazarnik P. - Warsaw University of Technology (PL)
Pietrzak K. - other affiliation
3.  Kucharski S., Jarząbek D.M., Piątkowska A., Woźniacka S., Decrease of Nano-hardness at Ultra-low Indentation Depths in Copper Single Crystal, EXPERIMENTAL MECHANICS, ISSN: 0014-4851, DOI: 10.1007/s11340-015-0105-2, Vol.56, No.3, pp.381-393, 2016

Abstract:
In the present study, we report a detailed investigation of the unusual size effect in single crystals. For the experiments we specified the hardness in single crystalline copper specimens with different orientations ((001), (011) and (111)) using Oliver-Pharr method. Our results indicates that with decreasing load, after the value of the hardness reached its maximum, it starts to decrease for very small indentation depths (<150 nm). For the sake of accuracy of hardness determination we have developed two AFM-based methods to evaluate contact area between tip and indented material. The proposed exact measurement of the contact area, which includes the effect of pile-up and sink-in patterns, can partially explain the strange behaviour, however, the decrease of hardness at low loads is still observed. At higher loads range the specified hardness is practically constant.

Keywords:
Copper, Single crystal, Nanoindentation, AFM, Size effect

Affiliations:
Kucharski S. - IPPT PAN
Jarząbek D.M. - IPPT PAN
Piątkowska A. - Institute of Electronic Materials Technology (PL)
Woźniacka S. - IPPT PAN
4.  Piątkowska A., Kucharski S., Detekcja uszkodzeń pomiarem EA oraz metodami mikroskopowymi, PROBLEMY EKSPLOATACJI. MAINTENANCE PROBLEMS, ISSN: 1232-9312, Vol.84, No.1, pp.17-25, 2012

Abstract:
W pracy opisane zostały pomiary emisji akustycznej EA generowanych podczas badania mikrotwardości wgłębnikiem Vickersa, na próbkach krzemowej i stalowej 3 l6L z warstwą węglową. Otrzymane wyniki w postaci wykresów w dziedzinie czasu są porównywane z obserwacjami mikroskopowymi. Za pomocą analitycznego elektronowego mikroskopu skaningowego SEM zobrazowano powierzchnie odcisków, z uwidocznieniem powierzchniowych pęknięć i uszkodzeń. Odcisk mikrotwardości został przecięty z użyciem systemu FIB, zapewniającego odsłonięcie rzeczywistej struktury wewnętrznej materiału w otoczeniu odcisku. Wykonanie sekwencji przekrojów pozwoliło na zobrazowanie SEM przestrzenne uszkodzeń, zwłaszcza typu pęknięcia i rozwarstwienia, a także usytuowanie elementów warstwy wierzchniej i podłoża oraz zasięg odkształceń plastycznych. Zastosowanie obu metod pomiarowych: emisji akustycznej oraz obrazowania mikroskopowego, wzajemnie uzupełniających się, daje wnikliwą diagnostykę do analizy właściwości mechanicznych materiału.

Keywords:
emisja akustyczna, badanie twardości, uszkodzenia, warstwa węglowa RF PACVD, FIB

Affiliations:
Piątkowska A. - Institute of Electronic Materials Technology (PL)
Kucharski S. - IPPT PAN

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