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Abstract:
Combination of extreme service conditions and complex thermomechanical loadings, e.g., in electronics or power industry, requires using advanced materials with unique properties. Dissipation of heat generated during the operation of high-power electronic elements is crucial from the point of view of their efficiency. Good cooling conditions can be guaranteed, for instance, with materials of very high thermal conductivity and low thermal expansion coefficient, and by designing the heat dissipation system in an accurate manner. Conventional materials such as silver, copper, or their alloys, often fail to meet such severe requirements. This paper discusses the results of investigations connected with Cu-C (multiwall carbon nanotubes (MWNTs), graphene nanopowder (GNP), or thermally reduced graphene oxide (RGO)) composites, produced using the spark plasma sintering technique. The obtained composites are characterized by uniform distribution of a carbon phase and high relative density. Compared with pure copper, developed materials are characterized by similar thermal conductivity and much lower values of thermal expansion coefficient. The most promising materials to use as heat dissipation elements seems to be copper-based composites reinforced by carbon nanotubes (CNTs) and GNP.

Keywords:
copper matrix composites, graphene, spark plasma sintering, thermal properties