Institute of Fundamental Technological Research
Polish Academy of Sciences

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D. P Ura


Recent publications
1.  Sara M., Ura D., Krysiak Z., Kaniuk Ł., Szewczyk P., Stachewicz U., Electrospun PCL Patches with Controlled Fiber Morphology and Mechanical Performance for Skin Moisturization via Long-Term Release of Hemp Oil for Atopic Dermatitis, Membranes, ISSN: 2077-0375, DOI: 10.3390/membranes11010026, Vol.11, No.1, pp.26-1-13, 2021

Abstract:
Atopic dermatitis (AD) is a chronic, inflammatory skin condition, caused by wide genetic, environmental, or immunologic factors. AD is very common in children but can occur at any age. The lack of long-term treatments forces the development of new strategies for skin regeneration. Polycaprolactone (PCL) is a well-developed, tissue-compatible biomaterial showing also good mechanical properties. In our study, we designed the electrospun PCL patches with controlled architecture and topography for long-term release in time. Hemp oil shows anti-inflammatory and antibacterial properties, increasing also the skin moisture without clogging the pores. It can be used as an alternative cure for patients that do not respond to traditional treatments. In the study, we tested the mechanical properties of PCL fibers, and the hemp oil spreading together with the release in time measured on skin model and human skin. The PCL membranes are suitable material as patches or bandages, characterized by good mechanical properties and high permeability. Importantly, PCL patches showed release of hemp oil up to 55% within 6 h, increasing also the skin moisture up to 25%. Our results confirmed that electrospun PCL patches are great material as oil carriers indicating a high potential to be used as skin patches for AD skin treatment.

Keywords:
PCL, electrospinning, fibers, tensile strength, hemp oil, skin patches, release, skin moisture, atopic dermatitis

Affiliations:
Sara M. - other affiliation
Ura D. - other affiliation
Krysiak Z. - IPPT PAN
Kaniuk Ł. - other affiliation
Szewczyk P. - other affiliation
Stachewicz U. - AGH University of Science and Technology (PL)

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